International
Target 3001
We will use the following layer allocation list. Please send us together with your data an information if there are differences.
| Target No. | Target Name | Description | WEdirekt Name |
|---|---|---|---|
| 16 | Copper Top | Top-Layer | VS |
| 15 | Deletion Top | Top-Layer | VS |
| 14 | Area Top | Top-Layer | VS |
| 2 | Copper Bottom | Bottom-Layer | RS |
| 18 | Soldermask Top | Soldermask Top | LSMVS |
| 4 | Soldermask Bottom | Soldermask Bottom | LSMRS |
| 21 | Position Top | Silcscreen Top | SEVS |
| 7 | Position Bottom | Silcscreen Bottom | SERS |
| 19 | Solder Paste Top | Solder Paste Top | PASTE-VS |
| 5 | Solder Paste Bottom | Solder Paste Bottom | PASTE-RS |
| 24 | Drill hole | PTH/NPTH-Drills and PTH slots |
BOHR1 BOHR2 |
| 13 | Copper inside | Innerlayer 2 | L2A00 |
| 12 | Deletion inside | Innerlayer 2 | L2A00 |
| 11 | Area inside | Innerlayer 2 | L2A00 |
| 10 | Copper inside | Innerlayer 3 | L3A00 |
| 9 | Deletion inside | Innerlayer 3 | L3A00 |
| 8 | Area inside | Innerlayer 3 | L3A00 |
| 23 | Outline | PCB-Contour, cut outs and slots | KONTUR |
