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WEdirekt:
Technical Guideline

The options in the online shop

Everything at a glance

pictures shows a pool and a non-pool manufacturing of a pcb

Here you can see an example of how the Pool and Non-Pool production types differ.

The options in the online shop

Everything at a glance

Please find below an overview of WEdirekt's technical possibilities.

Are you wondering what is meant by Pool and Non-Pool? Here's a quick overview:

Pool: We combine a lot of orders for different boards into a single production step and manufacture them "together." This way we can use our panels to capacity. We gladly pass on the resulting cost savings to you!

WEdirekt produces all Pool circuit boards according to IPC A 600 Class 2. 

 

Non-Pool: If you select an Non-Pool option in the circuit board configurator, it is not possible to combine your order with other orders for production. Such an order will then be produced as a single order.

WEdirekt produces all Non-Pool circuit boards based on IPC A 600 Class 2.

 

Do you need more?

Then send us your request by email. WEdirekt is the online shop for samples and prototypes from Würth Elektronik CBT. Within Würth Elektronik CBT we offer you many more technologies and delivery quantities. Benefit from a strong partner!

Overview of the options in our online shop configurator

WEdirekt options
Option Rigid PCBs (Pool and Non-Pool) HDI with/without Buried Vias  STARR.flex (2, 4 and 6 layer) PURE.flex (1F, 2F, 1F-Ri and 2F-Ri)
Minimum and maximum size of a single circuit board
  • Min. 30 x 15 mm
  • Max. 426 x 271 mm
  • Min. 30 x 15 mm
  • Max. 426 x 271 mm
 Available as delivery panel only

Available as delivery panel only
Minimum and maximum size of a delivery panel
  • Min. 30 x 15 mm
  • Max. 426 x 271 mm

Note: A single circuit board within a delivery panel must be at least 7 x 7 mm.
  • Min. 30 x 15 mm
  • Max. 426 x 271 mm

Note: A single circuit board within a delivery panel must be at least 7 x 7 mm.
  • Min. 30 x 15 mm
  • Max. 426 x 271 mm

Note: A single circuit board within a delivery panel must be at least 7 x 7 mm.
  • Min. 30 x 15 mm
  • Max. 426 x 271 mm

Note: A single circuit board within a delivery panel must be at least 7 x 7 mm.
Layer count
  • 1 to 8 layer(Pool)
  • Up to 16 layer (Non-Pool)
 4 - 8 layer 2 - 6 layer 1 und 2 layer
Material FR4 TG150 FR4 TG150 FR4 TG150
  • Polyimid
PCB thickness
  •  0,50 mm (Non-Pool)
  • 0,80 mm
  • 1,00 mm
  • 1,20 mm (Non-Pool)
  • 1,55 mm
  • 2,00 mm
  • 2,40 mm
  • 3,20 mm (Non-Pool)
  • 0,50 mm
  • 0,80 mm
  • 1,00 mm
  • 1,55 mm
  • 1,00 mm
  • 1,55 mm
  • 1F = 0,12 mm
  • 2F = 0,17 mm
  • 1F-Ri and 2F-Ri = Including stiffener 0,30 mm total
Structures outside and inside (depending on the desired end copper)
  • Min. ≥ 150 µm
  • ≥ 100 µm
  • ≥ 85 µm (with 18 µm end copper and 1 layer)
  • Min. ≥ 100 µm
  • Min. ≥ 100 µm
  • Min. ≥ 100 µm
End copper outside and inside (affects the required structures)
  • 18 µm (for 1 layer boards without galvanic metalization)
  • 35 µm
  • 70 µm
  • 105 µm (Non-Pool)

Note: Mixed copper is only manufactured as Non-Pool (mixed copper: final copper outside ≠ final copper inside)
  • 35 µm
  •  35 µm
  • 18 µm
  • 35 µm
Smallest Via
  • ≥ 0,25 mm (Pad ≥ 0,60 mm)
  • ≥ 0,10 mm (Pad ≥ 0,45 mm)
  • ≥ 0,25 mm (Pad ≥ 0,60 mm)
  • ≥ 0,10 mm (Pad ≥ 0,45 mm)
  • ≥ 0,25 mm (Pad ≥ 0,60 mm)
  • ≥ 0,10 mm (Pad ≥ 0,45 mm)
  • ≥ 0,25 mm (Pad ≥ 0,60 mm)
  • ≥ 0,10 mm (Pad ≥ 0,45 mm)
Smallest rout tool 
  • ≥ 1,60 mm
  • ≤ 1,50 mm and ≥ 1,10 mm
  • ≤ 1,00 mm and ≥ 0,50 mm
  • ≥ 1,60 mm
  • ≤ 1,50 mm and ≥ 1,10 mm
  • ≤ 1,00 mm and ≥ 0,50 mm
  • ≥ 1,60 mm
  • ≤ 1,50 mm and ≥ 1,10 mm
  • ≤ 1,00 mm and ≥ 0,50 mm
  • ≥ 1,60 mm
  • ≤ 1,50 mm and ≥ 1,10 mm
  • ≤ 1,00 mm and ≥ 0,50 mm
Surface
  • ENIG
  • HAL leadfree
  • Chemical Tin (SN)
  • ENIG
  • Chemical Tin (SN)
  • ENIG
  • Chemical Tin (SN)
  • ENIG
  • Chemical Tin (SN)
Solder resist Green Green Green Green
Legend
  • White
  • Yellow (Non-Pool)
  • Red (Non-Pool)
  • Blue (Non-Pool)
  • Black (Non-Pool)
  • White
  • Yellow
  • Red
  • Blue
  • Black
  • White
  • Yellow
  • Red
  • Blue
  • Black
 Without legend print only
Fully coated silkscreen: Our alternative for colored solder mask (Non-Pool feature)
  • White
  • Yellow
  • Red
  • Blue
  • Black
  • White
  • Yellow
  • Red
  • Blue
  • Black

Without fully coated silkscreen only

 Without fully coated silkscreen only
E-test
  • Optional for 1 and 2 Lagen
  • Included for ≥ 4 Lagen
 Always included

Always included

 Optional
UL Marking Optional Optional Optional no UL marking possible
Documentation Certificate of Conformity (COC), optional Certificate of Conformity (COC), optional Certificate of Conformity (COC), optional Certificate of Conformity (COC), optional
Additional options for rigid PCBs with non-pool manufacturing
  • Laser drill (micro-vias) 
  • Buried Vias
  • Chamfer (20° PCI and 45° ISA)
  • Edge plating 
  • Blind-Vias
  • Plugged Via (IPC4761, Type 3a)
  • Hard gold with plating ties
  • Laser drill (micro-vias) 
  • Buried Vias
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